MediaTek Pushes Flagship Smartphone Performance Further with the Dimensity 9200+

Hsinchu, Taiwan – Global fabless semiconductor company MediaTek has introduced its latest chipset for high-end 5G smartphones, the Dimensity 9200+, as an addition to its existing Dimensity lineup. The new chipset boasts improved performance compared to its predecessor, while still maintaining power efficiency to prolong battery life and enhance gaming experiences.

“We continue to raise the bar for flagship performance and power efficiency with the Dimensity 9200+, ensuring device makers have access to the most powerful mobile gaming features available today,” said Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business Unit. “With faster raytracing and fluid gameplay at high frame rates, combined with MediaTek’s power-saving technologies, you can enjoy incredible visuals, epic effects, and extended battery life.”

With enhanced clock speeds compared to its predecessor, the Dimensity 9200 chipset, the Dimensity 9200+ incorporates advanced processing power. It combines an ultra-core Arm Cortex-X3 clocked at up to 3.35GHz, three Arm Cortex-A715 super-cores operating at a maximum frequency of 3.0GHz, and four Arm Cortex-A510 efficiency cores running at 2.0GHz. In order to elevate the performance of the Dimensity 9200+ for demanding tasks like gaming, MediaTek has elevated the Arm Immortalis-G715 GPU of the chipset by an impressive 17%.

The Dimensity 9200+ has a 4CC-CA 5G Release-16 modem that fluidly switches between long-reach sub-6GHz and super-fast mmWave connections. The chipset also supports Wi-Fi 7 2×2 + 2×2 with up to 6.5Gbps data rate, along with Bluetooth 5.3. MediaTek’s Bluetooth and Wi-Fi coexistence technology allows Wi-Fi, Bluetooth low energy (LE) audio, and wireless peripherals to connect at the same time with extremely low latency and without inference.

Here are the key features of MediaTek Dimensity 9200+:

• HyperEngine 6.0: Further improving the gaming experience with adaptive performance technology capable of sustaining high framerates and minimizing latency.
• Second generation TSMC 4nm-class process: Ideal for ultra-slim designs in a variety of form factors.
• Sixth generation AI Processing Unit (APU 690): Efficiently powers AI-noise reduction and AI-super resolution tasks, and creates truly cinematic video through real-time focus and Bokeh adjustments.
• MediaTek Imagiq 890: Powerful flagship image signal processor that supports captivating capture, providing bright, sharp images and videos even in low-light scenarios.
• MediaTek MiraVision 890: Display technology with adaptive refresh rate technology and motion blur reduction for a fluid user experience.
• MediaTek 5G UltraSave 3.0: Power efficiency technologies to optimize battery life for all 5G connection conditions.

Smartphones powered by the MediaTek Dimensity 9200+ are expected to be released in May 2023.